YVi-X2H Inline AOI with X ray/ LASER/
Infrared/Visible rays for Post-reflow
 |
FEATURES
- X-ray solder test: Underside electrode of CSP,BGA, etc. 100% tested.
- High-speed testing using 3-step dome lighting:
25msec/cm2 (about 6 seconds for 150 x 150mm area, single lighting).
- Testing in Z direction using sharp angle LASER.
Technical Data
| Model | YVi-X2H（Model:LE2-610） |
| Applicable PCB | L460 x W410mm to L50 x W50mm (Laser 1 unit), L390 x W410mm to L50 x W50mm (Laser 2 units) |
| Test speed | 25 msec/cm2 (Equivalent to about 6 seconds for □150mm area) : Under single lighting, optimum condition 51 msec/cm2 (Equivalent to about 12 seconds for D150mm area) : Under 3 lighting + X-ray, optimum condition |
| Test resolution | LASER (XY direction) 1μm, LASER (Z direction) 10μm, Visible rays 20μm, Infrared 20μm, X-ray 20μm |
| Test item (Post-reflow) | Position error, missing item, polarity, different item, angle deviation, standing, top/bottom, bent lead, bridge, character recognition, fillet (standard) floating chip, floating lead (LASER), foreign object, solder ball of component (under YAMAHA condition) |
Power supply |
Single-phase AC200/208/220/230/240V +/-100/0 50/60Hz |
| Air supply source | 0.4 MPa or more, in clean, dry state. |
| External dimension <Note 1> | L1,350 x W1 ,5S0 x H1 ,470mm (cover top) |
| Weight | Approx. 1,920kg |
<Note 1> This dimension does not include the projection.