HOT LINE UP

LamyRheology Viscometer  Rheometer

LamyRheology Viscometer
Rheometer

Sekonic Oscillation Viscometer

Sekonic Oscillation Viscometer

Refrigerated & Heated Circulating Baths

Refrigerated & Heated Circulating Baths

Heller Mark 5 Series Reflow System

Heller Mark 5 Series Reflow System

HOT LINE UP

gas nitriding/nitro-carburizing control system

Gas Fired Air Heater Unit

gas nitriding/nitro-carburizing control system

Compound layer simulation software

gas nitriding/nitro-carburizing control system

gas nitriding/nitro-carburizing control system

nitriding simulation

nitriding simulation

SURFACE MOUNTER

YS24 Compact Super-High-Speed Modular

小型超高速モジュラー
  • 72,000CPH (0.05sec/CHIP) Excellent mounting capability Newly developed "Dual Stage Conveyor"
  • L700xW460mm Super large PCB applicable
  • 120 Max feeder capacity
  • 0402~32x32mm Components applicable
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YS24X Compact High-Speed Flexible Modular

小型高速汎用モジュール
  • 54,000CPH The top mounting capability in multi-purpose mounters
  • L700xW460mm Super large PCB applicable
  • sATS Automatic Tray Supply Unit applicable
  • 0402~45x100mm Components applicable
  • H15mm hight applicable
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YS12 Compact High-Speed Modular

小型高速汎用モジュール
  • Both new designed 10 inline multi-heads and new recognition system ensure 36,000CPH
    (O.1sec/CHIP Equivalent: optimum condition).
  • Maximum feeder capacity 120 lanes.
  • Applicable to large size PCB (L510mm x W460mm).
  • Built-in tape cutter available as an option.
  • Conformity with both Machinery directive and EMC directive (CE marking).
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YS100 High-Speed general Modular

高速汎用モジュラー
  • High-speed mounting capacity handling 25,000CPH (O.14sec/CHIP Equivalent: optimum
    condition)
  • +/-50lJm (CHIP), +/-30lJm (QFP) mounting absolute accuracy in full time operation.
  • Handles a wide range of components from 0402 chips to □45mm components and with
    long connectors.
  • Capable of handling 15mm height components.
  • Applicable to large size PCB (L510mm x W460mm).
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YS88 Multi-Functional Wide-range modular

多機能異形モジュラー
  • Handles a super-wide range of components from 0402 chips to □55mm components and with long connectors.
  • Handles components with heights up to 25.5mm.
  • Simplified Pressing force control from 10 to 30N. +/-30 μm QFP mounting absolute accuracy and +/-20 μm QFP Repeatability in full time operation.
  • 8,400CPH (0.43 sec/CHIP Equivalent: optimum condition) mounting capacity.
  • Applicable to large size PCB (L510mm x W460mm).
Products Information