HOT LINE UP

LamyRheology Viscometer  Rheometer

LamyRheology Viscometer
Rheometer

Brookfield Texture Analyzer

Brookfield Texture Analyzer

Sekonic Oscillation Viscometer

Sekonic Oscillation Viscometer

Refrigerated & Heated Circulating Baths

Refrigerated & Heated Circulating Baths

Heller Mark 5 Series Reflow System

Heller Mark 5 Series Reflow System

High-Speed High-Precision Hybrid AOI model YSi-12

High-Speed High-Precision Hybrid AOI model YSi-12

HOT LINE UP

gas nitriding/nitro-carburizing control system

Gas Fired Air Heater Unit

gas nitriding/nitro-carburizing control system

Compound layer simulation software

gas nitriding/nitro-carburizing control system

gas nitriding/nitro-carburizing control system

nitriding simulation

nitriding simulation

FLIP CHIP・DIE BONDER

YHP-2 Hybrid placer (advanced flip chip & die bonder)

YHP-2
  • Capable of mixed mounting of SMD components and semi-conductor components
  • Capable of handling multiple types of the dipping unit
  • Usable for dipping &stamping by the dipping unit
  • Applicable for a wide area up to L300mm x W200mm
Products Information

 

 

YHP-2D

HUD-2D