YHP-2
Hybrid placer (advanced flip chip & die bonder)
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FEATURES
- Capable of mixed mounting of SMD components and semi-conductor components
- Capable of handling multiple types of the dipping unit
- Usable for dipping &stamping by the dipping unit
- Applicable for a wide area up to L300mm x W200mm
Technical Data
| PCB dimensions | L300xW200mm(Max)～Ｌ３０ｘＷ３０ｍｍ(Ｍin） | |
| PCB thickness | 0.1ｍｍ～3.0ｍｍ | |
| PCB transport diredion | Right→left(option；left→right） | |
| Conveyor reference | Front side(option：rear side） | |
| Mounting accuracy | F type | Absolute accuracy (μ＋３σ):±20μm |
| 4Ｍ type | Absolute accuracy (μ＋３σ):±30μm |
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| Load control | F type | Load control range；１ to 49N Load control accuracy；１ to 9.8N:±10% Load control accuracy；9.8 to 49N:±5% |
| 4Ｍ type | Load control range；2 to 10N Load control accuracy；±20% |
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| Mounting/dispensing cycle time (Under optimum conditions) *Procee time not included |
4Ｍ type | 0.5sec/CＨＩＰ(When continuos pickup at work) |
| FF type | 0.8se/CＨＩＰ(Tape reel and tray supply case） 1.3sec/CHIP(Wafer supply case） | |
| FD type | As the measure as vary depending on the operation, please consult separately. | |
| No. of componebt types (Max, for 8mm tape conversion) |
When using the front side 8 in-line plate (in front of the conveyor installation position) |
36 types(8＋8＋20), 28 types(8＋20)，16 types(8＋8) or 8 types(8×1） *The number of type is reduced depending on equipment of the supply system and supplementary system. |
| When using the front side 20 in-line plate (in front of the conveyor installation position) |
40 types(20+20) or 20 types (20 x1) *The number of type is reduced depending on equipment of the supply system and supplementary system. |
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| Component supply configuration | ●Tape reel ●Bulk ●2,4inch waffle tray (Equipped with an auto-changer） ●6,８inch wafer (Capable of handling expanded wafer and simple expanding, placing with face-up and face down) |
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| Component applicable for mounting | 0402～□15mm component (*1:As a special nozzle and a special feeder are required, please consult separately) SOP,SOJ,QFP,connector, PLCC,CSP,BGA,PGA,Flipchip,Barechip,Wafer-level CSP, Other special components(Please consult separately.) |
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| Power supply | 3-phase AC200/208/220ﾉ240/380/400/416Ｖ±10％ 50/60Ｈｚ | |
| Rating | 4.4kVA | |
| Average power consumrtion *When running Yamaha's standard operations |
0.7kW | |
| Air supply source | 0.55Mpa or more, 300l/min.(ANR)(Max), in clean, dry state | |
| External dimensions | L1,350xW1,408xH1,850mm | |
| Weight | Approx. 1,450kg | |